Chapter 2: Hardware Installation and Connector Technologies
Mastering Motherboard Integration and Connection Standards
Video Content Prompts
- Show visual examples of different connectors and ports
- Demonstrate proper cable connection techniques
- Emphasize safety procedures and ESD protection
- Compare different interface speeds and capabilities
- Use motherboard diagrams and real hardware examples
2.1 Computing Systems and External Device Connectivity
2.1.1 Desktop Computer Architecture
Desktop computer systems comprise two primary component categories: user-accessible peripheral equipment and protected internal hardware housed within the system enclosure. This protective chassis shields sensitive components from physical damage and environmental hazards while maintaining operational safety standards.
External peripherals encompass input mechanisms (keyboards, pointing devices, audio capture equipment, imaging devices), output systems (visual displays, audio reproduction equipment), and portable storage solutions. The system enclosure, commonly configured as a vertical tower design, contains critical internal components including the primary circuit board, central processor, memory modules, expansion cards, permanent storage devices, and electrical power distribution unit.
Contemporary computing systems are also available as integrated all-in-one configurations, where internal components are consolidated within a monitor housing, eliminating the separate tower enclosure requirement.
Proper System Access: Tower configurations feature removable side panels secured through screw fasteners or retention clips, potentially incorporating tamper-evident security mechanisms. System documentation should always be consulted before attempting enclosure access to ensure proper disassembly procedures.
The front access panel provides user interaction points including removable media drive bays, system power controls, and status indicator lights. This panel can be removed for maintenance access, though side panel removal may be prerequisite for accessing internal mounting hardware.
The rear access panel houses power supply connections, including integrated exhaust ventilation systems. Adequate ventilation clearance is essential for maintaining proper thermal management. Additional case ventilation fans may be present for enhanced cooling performance.
Below the power supply unit, a precision cutout accommodates the motherboard's input/output port cluster, protected by a dust-prevention shield. Lower rear panel sections feature expansion card slot cutouts, covered by installed adapter cards or protective blanking plates. These protective barriers prevent:
- Environmental contamination leading to component thermal stress
- Enhanced electrostatic discharge exposure potentially damaging semiconductor components
- Electromagnetic interference penetration affecting system reliability
The enclosure provides electromagnetic shielding, with gaps compromising this protection significantly.
2.1.2 External Device Interface Technologies
Input/output connection points enable peripheral device integration through specialized cables. While some interfaces serve dedicated functions like display connectivity, others support multiple device categories. External connection points are accessible through enclosure cutouts, originating from either motherboard-integrated interfaces or expansion card implementations.
Interface Architecture and Connection Standards
Hardware connection points serve as external access terminals for internal bus architectures, facilitating bidirectional data transmission between system and peripheral components. Cable connectors feature precision-engineered contacts designed for secure port engagement. Contemporary connector designs emphasize asymmetric or keyed configurations preventing incorrect insertion, with many supporting reversible orientation.
Binary Information Processing and Transfer Metrics
Bus interface performance comparisons require appropriate measurement units. Computing systems process binary information where individual bits represent 0 or 1 values. Storage capacity measurements utilize bytes (eight-bit groups), distinguished through capitalization: lowercase "b" indicates bits, uppercase "B" represents bytes.
Data Transfer Rate Measurements:
- Kilobit (Kb/s or Kbps) and Kilobyte (KB/s and KBps) measurements: 1,000-unit multiples
- Megabit (Mb/s) and Megabyte (MB/s) measurements: 1,000,000-unit multiples
- Gigabit (Gb/s) and Gigabyte (GB/s) measurements: 1,000,000,000-unit multiples
2.1.3 Universal Serial Bus Connection Technology
Universal Serial Bus represents the predominant standard for peripheral device connectivity in modern computing environments. USB devices are organized into functional classifications including human interface equipment (input devices), mass storage systems (disk drives), printing devices, and audio hardware. USB operations are coordinated through host controller integrated circuits supporting multiple connection points on shared bus architectures. Individual controllers theoretically accommodate up to 127 connected devices, though bandwidth constraints drive motherboard designs incorporating multiple controllers with three to four ports each.
USB Connector Design Standards
USB 2.0 connector configurations include:
- Type A: Rectangular flat connector for host systems and select peripherals, requiring symbol-oriented insertion
- Type B: Square connector with beveled edge for larger peripherals like printing equipment
- Type B Mini: Compact connector for smaller devices such as early digital cameras, now largely obsolete
- Type B Micro: Low-profile connector for compact devices including smartphones and tablets
USB cable assemblies feature Type A to Type A configurations or conversion designs (Type A to Type B or Type A to Micro Type B arrangements).
USB 3.0 introduces enhanced connector versions with additional signaling conductors and contact points, typically identified through blue connector accents or housing colors. USB 3.0 Type A maintains backward compatibility with USB 1.1 and 2.0 standards, while Type B and Micro Type B connections lack cross-version compatibility.
USB 3.1 introduces the USB-C connector featuring compact, reversible, and robust construction aimed at providing standardized hardware interfaces. USB-C implementations support both cable ends or integrate with adapter cables for Type A or Type B compatibility.
Cable Length Specifications
Maximum cable distances are 3 meters for low-speed applications and 5 meters for full-speed and high-speed implementations. Extended cables may be available from vendors, though performance degradation occurs beyond specified limits. SuperSpeed-capable cables recommend 3-meter maximum lengths without official distance restrictions.
Power Distribution Capabilities
USB bus architectures provide both data transmission and electrical power to connected peripherals. Most Type A and Type C interfaces support device battery charging functionality. Standard USB connections supply up to 4.5 watts depending on implementation version, while Power Delivery specifications enable up to 100 watts through appropriate connectors and cabling.
2.1.4 USB Technology Evolution
USB standard development has delivered substantial improvements in transfer speeds, power distribution, and operational capabilities:
USB Evolution Timeline:
- USB 1.0 (1996): Initial implementation supporting 1.5 Mbps (Low Speed) and 12 Mbps (Full Speed) with Type-A and Type-B connectors
- USB 1.1 (1998): Enhanced reliability and compatibility improvements maintaining original speed specifications
- USB 2.0 (2000): Increased performance to 480 Mbps (High Speed) introducing Mini-A/B and Micro-A/B connector types
- USB 3.0 (2008): SuperSpeed capability at 5 Gbps with new connector designs including Micro-B, subsequently rebranded as USB 3.1 Gen 1
- USB 3.1 (2013): SuperSpeed+ performance at 10 Gbps featuring versatile Type-C connectors, rebranded as USB 3.1 Gen 2
- USB 3.2 (2017): Multiple performance tiers including Gen 1 (5 Gbps), Gen 2 (10 Gbps), and Gen 2x2 (20 Gbps) supporting Type-A, Type-B, and Type-C connectors
- USB4 (2019): Maximum speeds reaching 40 Gbps with Thunderbolt 3 integration, exclusively utilizing Type-C connectors supporting advanced multi-protocol capabilities
Contemporary SuperSpeed nomenclature has transitioned to simplified bitrate designations: USB 5Gbps, USB 10Gbps, USB 20Gbps, and USB 40Gbps.
2.1.5 Visual Display Technologies
Display technology advancement has produced diverse options addressing varied application requirements. Liquid Crystal Display (LCD) technology dominates with three primary implementations:
- In-Plane Switching (IPS): Liquid crystal alignment parallel to screen surfaces enabling consistent light transmission and color fidelity
- Twisted Nematic (TN): Liquid crystal 90-degree rotation between electrodes controlling light passage for image generation
- Vertical Alignment (VA): Vertical liquid crystal alignment to glass substrates with voltage-controlled tilting for light management
Beyond LCD implementations, display technologies encompass OLED and Mini-LED alternatives. Organic Light-Emitting Diode (OLED) displays feature individual pixel illumination through organic compounds activated by electrical current. Mini-LED displays utilize thousands of miniature LEDs for backlighting precision, enabling enhanced brightness and contrast control.
Display Technology Comparison:
In-Plane Switching (IPS) LCD:
Benefits: Exceptional color accuracy and wide viewing angles optimal for graphic design and professional applications
Limitations: Generally slower response times compared to TN implementations potentially affecting high-speed gaming
Twisted Nematic (TN) LCD:
Benefits: Faster response times and higher refresh rates preferred for gaming applications
Limitations: Inferior color reproduction and restricted viewing angles
Vertical Alignment (VA) LCD:
Benefits: Superior color accuracy and viewing angles compared to TN technology
Limitations: Slower response times than TN but improved over IPS in specific cases, with potential color shifting at extreme viewing angles
Organic Light-Emitting Diode (OLED):
Benefits: Outstanding color accuracy, contrast ratios, energy efficiency, and true black levels through self-illuminating pixels
Limitations: Burn-in susceptibility where static images may create permanent retention effects
Mini-LED Technology:
Benefits: Enhanced brightness, improved contrast and black levels, superior color accuracy, reduced halo effects, thin lightweight designs suitable for diverse applications
Limitations: Higher cost, potentially increased power consumption versus OLED, reduced blooming without achieving OLED's true blacks, manufacturing complexity
2.1.6 Display Component Analysis
Display component understanding proves essential for evaluating screen performance and application suitability. Critical elements include interactive touch screens and digitizers, inverters for legacy LCD backlighting, and performance attributes like pixel density, refresh rates, and resolution determining image quality.
Key Component Categories:
- Touch Screens and Digitizers: Interactive display integration enabling direct touch or stylus interaction, common in smartphones, tablets, and select laptops
- Inverter Circuits: Essential in legacy LCD implementations for DC to AC power conversion supporting backlight operation; contemporary LED-backlit displays typically eliminate inverter requirements
- Performance Specifications:
- Pixel Density: Higher density produces sharper image quality
- Refresh Rates: Higher frequencies (measured in Hz) provide smoother motion critical for gaming and video content
- Screen Resolution: Determines display clarity and detail levels
Common Resolution Standards:
- Full HD (1920x1080)
- Quad HD (2560x1440)
- 4K (3840x2160)
- Emerging standards: 5K (5120x2880) and 8K (7680x4320) offering enhanced clarity
Color Gamut: Represents displayable color range based on RGB color models. Broader gamuts enable more vibrant and accurate color reproduction enhancing visual experiences for photo editing, video production, and gaming. Standard gamuts include sRGB, Adobe RGB, and DCI-P3, with DCI-P3 offering expanded color range compared to sRGB. Color depth significance includes 24-bit color (true color) supporting approximately 16.7 million colors, while 32-bit color incorporates alpha channel transparency for detailed color representation and smooth gradients.
Video Cable Bandwidth Requirements
Video cable bandwidth depends on two primary factors:
- Resolution: Measured in pixels (1920x1080 for Full HD, 3840x2160 for 4K)
- Refresh Rate: Measured in hertz (Hz) or frames per second (fps)
Uncompressed HD video at 60 fps requires 4.5 Gbps, while 4K at 60 fps demands 8.91 Gbps.
Frame rate (fps) characterizes video source specifications, while hertz (Hz) indicates display refresh capabilities. Optimal performance requires refresh rate matching or division compatibility with frame rates to prevent ghosting and tearing artifacts.
2.1.7 Digital Video Interface Standards
HDMI (High-Definition Multimedia Interface) and DisplayPort cables offer distinct advantages requiring appropriate selection based on device requirements and performance objectives.
High-Definition Multimedia Interface (HDMI)
HDMI cables prove essential for multimedia configurations through simplicity and versatility:
- Functionality: Single-cable transmission of high-definition video and audio signals
- Standard Applications: Consumer electronics connectivity including televisions, monitors, gaming consoles
- Version Evolution: Progressive versions offering higher resolutions, increased refresh rates, advanced features like HDR (High Dynamic Range) for enhanced color and contrast
- Advantages: Single-cable solutions simplifying connections with broad device compatibility
DisplayPort Technology
DisplayPort delivers superior performance for high-resolution and multi-display configurations, making it preferred for demanding visual applications:
- Purpose: Digital display interface connecting video sources to display devices such as computer monitors
- Preferred Applications: Professional environments and gaming configurations
- Key Features: Higher resolution and refresh rate support compared to HDMI, Multi-Stream Transport (MST) enabling multiple display connections through single ports
- Additional Capabilities: Audio transmission support, adaptive sync technology compatibility including AMD FreeSync and NVIDIA G-Sync reducing gaming screen tearing
2.1.8 Thunderbolt Interface Technology
While Thunderbolt and Lightning interfaces are closely associated with Apple computing and mobile platforms, Thunderbolt implementation increasingly extends to Windows and Linux PC systems.
Thunderbolt serves dual purposes as display interface comparable to DisplayPort or HDMI and general peripheral interface similar to USB functionality.
Thunderbolt Evolution:
Thunderbolt 1 and 2: Utilize MiniDP physical interfaces with DisplayPort compatibility, enabling monitor connections via Thunderbolt ports and adapter cables. Thunderbolt ports feature lightning bolt identification icons. Thunderbolt 2 supports 20 Gbps throughput with daisy-chaining capabilities for multiple monitors.
Thunderbolt 3: Transitions to USB-C physical interface utilizing identical ports, connectors, and cabling. Converter cables enable Thunderbolt 1 or 2 device connectivity to Thunderbolt 3 ports. USB devices operate normally in Thunderbolt 3 ports, though Thunderbolt devices remain incompatible with non-Thunderbolt USB-C implementations. Thunderbolt 3 supports 40 Gbps over short, high-quality cables (0.5 meter maximum).
Thunderbolt 4: Maintains USB-C interface supporting 40 Gbps with enhanced minimum performance requirements and expanded capabilities including dock support for up to four Thunderbolt 4 ports.
Thunderbolt 5: Continues USB-C interface implementation offering enhanced speeds and features with technology-specific details varying as development progresses.
Thunderbolt ports provide versatile support for high-speed data transfer, video output, and device daisy-chaining. USB-C form factor compatibility requires verification as not all USB-C ports support Thunderbolt interfaces. Flash icons on ports or system documentation confirm Thunderbolt support.
2.1.9 Lightning Interface Technology
Apple's proprietary Lightning interface serves as the primary connector for iPhone and iPad devices. Introduced in 2012, Lightning replaced the previous 30-pin dock connector with compact, reversible design enhancing user convenience.
Exclusively implemented in Apple mobile devices, Lightning ports require Lightning-to-USB A or Lightning-to-USB C adapter cables for PC and device connectivity, supporting both charging and data transfer functions.
Lightning interface adoption is transitioning toward USB-C standardization driven by:
- Industry Standardization: USB-C widespread adoption for versatility, enhanced data transfer, and superior power delivery
- Regulatory Requirements: Organizations like the European Union promoting common charging standards reducing electronic waste and improving convenience
- Technological Progress: USB-C superior features providing future-proof solutions
2.1.10 Serial Advanced Technology Attachment Interface
Internal component connectivity extends beyond external peripheral cabling to include motherboard port connections for specific component types.
Serial Advanced Technology Attachment (SATA) represents the standard for internal storage drive connectivity in desktop PC systems, utilizing cables up to 1 meter with compact 7-pin connectors, each supporting individual device connections.
The 7-pin data connector provides no power supply; separate 15-pin connectors handle power distribution. Initial SATA standard supported 150 MBps speeds, enhanced to 300 MBps with SATA revision 2 and 600 MBps with SATA revision 3.
SATA Revisions 3.1 through 3.5 introduced enhancements including SATA Universal Storage Module, SATA Express specifications, and improved I/O protocol integration without speed increases.
2.1.11 Molex Power Connection Systems
Internal storage device data cables exclusively handle data transmission without power delivery. Power supply requires SATA power connectors for contemporary devices, while legacy components utilize 4-pin Molex connectors from power supply units. These connectors feature white or clear plastic construction.
Molex connectors incorporate wire insulation color coding indicating voltage levels: red for 5 volt direct current (VDC), yellow for 12 volt direct current (VDC), and black for ground connections. Direct current (DC) represents unidirectional electrical charge flow essential for electronic component operation.
Some devices may feature both SATA and Molex power connector options.
2.1.12 External SATA Technology
External Serial Advanced Technology Attachment (eSATA) standard enables peripheral drive connectivity using cables up to 2 meters in length. eSATA cable requirements differ from internal SATA cables due to incompatibility. Some vendors provide nonstandard powered port implementations called eSATAp supporting both USB and SATA through eSATAp cabling. Despite these options, USB interface dominance continues for external drive applications.
2.2 Motherboard Architecture and Integration
2.2.1 Motherboard Operational Functions
Computer software and data processing relies entirely on binary code (ones and zeros). Software execution occurs through central processing unit (CPU) instruction processing, representing the computational function of PC systems.
Instructions and data require storage solutions. CPU internal storage capacity remains limited, necessitating additional storage through system memory or random-access memory (RAM) for running programs and active data files. RAM represents nonpersistent storage, maintaining data only during powered operation. Mass storage devices preserve data during system shutdown periods.
CPU, cache, and RAM provide fast but volatile storage, while mass storage and removable storage devices offer slower but permanent data preservation.
Processing and storage components interconnect through motherboard bus interfaces. Instructions and data storage utilize transistors and capacitors with electrical signal transmission over bus architectures. Motherboard system clock synchronizes PC operations providing basic timing signals for CPU operation, measured in megahertz (MHz) or gigahertz (GHz). Clock multipliers adjust timing signals producing varied speeds for different buses, enabling multiple operational frequencies.
Motherboard selection affects system performance and determines compatible devices and adapter cards for installation or upgrades. Major motherboard manufacturers include AOpen (Acer), ASRock, ASUSTek, Biostar, EVGA Corporation, Gigabyte, Intel, and MSI. Each motherboard supports specific CPU ranges, with PC CPUs primarily manufactured by Intel and Advanced Micro Devices (AMD).
2.2.2 Electrical Safety and Electrostatic Discharge Prevention
System case opening for upgrades or troubleshooting requires proper operational procedures ensuring personal safety and minimizing component damage risks.
Electrical Safety Protocols:
PC work safety requires power supply disconnection before case opening. After power cord removal, power button depression for several seconds drains residual charge from internal components. Never attempt disassembly of non-field-serviceable components such as power supply units.
Electrostatic Discharge Protection:
Sensitive electronic component protection requires appropriate tools and procedures. Components including CPU, system RAM, adapter cards, and motherboards remain vulnerable to electrostatic discharge (ESD) occurring when static charges from clothing or body contact suddenly release into circuits. Component handling should focus on edges or plastic sections, ideally utilizing anti-ESD wrist straps and protective equipment.
2.2.3 Motherboard CPU and Memory Connection Systems
Motherboards incorporate various connector and socket types for system devices: CPU, memory, fixed disk drives, and adapter cards.
CPU Socket Technology
Contemporary motherboards typically support latest CPU models from major manufacturers including Intel and AMD, each utilizing different socket designs. Rapid CPU technology advancement limits motherboard compatibility to specific processor model ranges.
CPU sockets feature distinctive square shapes. Post-installation CPUs require thermal paste application, heat sink mounting, and fan installation for thermal management.
Motherboard chipsets support CPU operations by managing data transfer between CPU and various devices. These chipsets are permanently soldered onto motherboards preventing upgrade capabilities. Chipset specifications determine compatible processors, RAM type and maximum capacity, and integrated interface support for video, sound, and networking. Unsupported interfaces can be added or upgraded through adapter cards.
System Memory Slot Configuration
System memory utilizes random-access memory (RAM) technology featuring volatile characteristics losing content during power removal. Program code and data load into RAM for processor access and execution.
System RAM typically packages as dual inline memory modules (DIMMs) fitting into motherboard slots near CPU sockets. These slots feature end catches and often incorporate numbering and color coding. Slot labels typically indicate supported DIMM types.
RAM technologies evolved through generations including DDR3, DDR4, and DDR5, with each DIMM form factor specific to DDR versions. DDR progression from single 64-bit channels per DIMM (earlier generations) to DDR5 enabling dual 32-bit subchannels per DIMM, significantly higher base speeds, and On-DIMM Power Management Integrated Circuits (PMIC) versus motherboard voltage regulator control.
Memory controller capabilities and physical slot quantities determine maximum installable memory capacity.
2.2.4 Motherboard Storage Connection Interfaces
Internal PC case fixed disks provide persistent storage for operating systems, software, and data files utilizing solid-state drive (SSD) or hard disk drive (HDD) technologies.
Serial Advanced Technology Attachment Interface
Motherboards contain multiple SATA ports for fixed drive connectivity. SATA also connects removable drives including tape drives and optical drives (DVD/Blu-ray). SATA devices install in chassis drive bays connecting to data ports via cables and power supplies through SATA power or Molex connectors.
M.2 Interface Technology
SSD provisioning can utilize adapter card form factors, often implementing M.2 interfaces. M.2 ports orient horizontally with adapter cards inserted at angles, pushed into position, and secured with screws. M.2 adapters feature different lengths (42 mm, 60 mm, 80 mm, or 110 mm) requiring motherboard compatibility verification. Labels indicate supported adapter sizes. M.2 supplies power over bus architecture eliminating separate power cable requirements.
External SATA Interface Implementation
External SATA (eSATA) cables design for external connections featuring superior shielding compared to internal SATA cables supporting longer lengths (2 meters maximum) and external environment resistance. Power over eSATA (eSATAp), also known as "eSATA/USB Combo," combines eSATA and USB functionality in single ports providing external device power unlike standard eSATA. eSATA and eSATAp remain less common as USB 3.x, Thunderbolt, and other high-speed connections offer superior speeds, greater versatility, and broader adoption.
eSATA primary limitation compared to USB or Thunderbolt involves lack of cable power supply. While acceptable for 3.5-inch drives requiring separate power sources, this limits eSATA usefulness for 2.5-inch portable drives.
2.2.5 PCI Express Interface Architecture
Expansion slots accommodate plug-in adapter cards extending computer functionality. Two primary expansion slot interface types exist.
PCI express bus represents the standard interface for contemporary adapter cards utilizing point-to-point serial communication providing each component with dedicated links to other components.
Each point-to-point connection constitutes a link utilizing one or more lanes. Raw transfer rates per lane depend on PCIe version measured in giga transfers per second (GT/s). Throughput in GB/s represents effective rates after encoding loss accounting.
PCIe Configuration Guidelines:
Adapter slots with additional lanes feature increased physical length. Each PCIe adapter card supports specific lane quantities, typically x1, x4, x8, or x16. Optimal configuration involves card installation in ports with matching lane quantities. However, limited slot availability allows card installation in ports with equal or greater lane quantities, known as up-plugging (x8 card in x8 or x16 slot). Cards should operate at x8 but may sometimes function at x1. Down-plugging, installing longer cards in shorter slots, remains possible if card obstruction doesn't occur.
Slot lane support may be fewer than physical size suggests, indicated by motherboard labels (x16 slot supporting only x8 operation labeled as x16/x8 or x16 @ x8).
All PCIe versions maintain backward compatibility enabling PCIe version 2 adapter connection to version 4 motherboards or version 3 adapter connection to version 2 motherboards, with bus links operating at lowest version component speeds.
PCIe supplies up to 75W to graphics cards via dedicated graphics adapter slots and up to 25W through other slots. Additional 75W can be supplied via PCIe power connectors.
Multiple PCIe slots on motherboards don't guarantee full-speed operation for each slot. If PCIe slots share lanes with other components including additional PCIe slots or M.2/NVMe slots, available bandwidth divides among connected components reducing individual slot speeds as total bandwidth distributes across connections.
2.2.6 Legacy PCI Interface Technology
Computer systems can support multiple expansion buses accommodating older technologies. Peripheral Component Interconnect (PCI) represents legacy bus architecture superseded by PCI Express (PCIe). PCIe maintains software compatibility with PCI enabling PCI ports on PCIe motherboards supporting legacy adapter cards, though PCI cards cannot install in PCIe slots.
PCI utilizes parallel communication typically featuring 32-bit architecture operating at 33.3 MHz with transfer rates up to 133 MBps. Early PCI cards designed for 5V signaling, though 3.3V and dual-voltage cards became common. Different keying prevents incompatible card insertion into motherboard slots for 5V, 3.3V, and dual-voltage cards.
2.2.7 Motherboard Form Factor Standards
Motherboard form factors define shape, layout, compatible cases, power supplies, and installable adapter card quantities.
Advanced Technology eXtended Form Factor
Advanced technology extended (ATX) specification represents standard form factor for most desktop PC motherboards and cases. Full-size ATX boards measure 12 x 9.6 inches (305 x 244 mm) accommodating up to seven expansion slots.
Micro-ATX (mATX) standard specifies 9.6 x 9.6 inch (244 x 244 mm) square boards with maximum four expansion slots. Most mATX boards can mount in ATX cases.
Information Technology eXtended Form Factor
Small form factor (SFF) PCs gain popularity for home use and mini servers, often utilizing Via's Mini-ITX (information technology extended) form factor.
Mini-ITX boards measure 6.7 x 6.7 inches (170 x 170 mm) featuring one expansion slot. These boards design for small cases but can also mount in ATX cases. Smaller nano-, pico-, and mobile-ITX form factors serve embedded systems and portables, not PCs.
No commercial motherboards were produced from original plain ITX specifications.
2.2.8 Motherboard Installation Procedures
Motherboard installation involves chassis securing and various component connections. Follow these steps for successful installation:
Installation Steps:
- Documentation Review: Familiarize yourself with motherboard installation procedures using provided documentation. Check jumper setting requirements, noting contemporary motherboards often handle configurations through BIOS/UEFI rather than physical jumpers.
- ESD Protection: Electrostatic discharge (ESD) protection requires anti-static wrist strap usage or grounding before component handling.
- I/O Shield Installation: If motherboard lacks pre-installed I/O shield, align shield with rear I/O ports and snap into case position.
- Standoff Insertion: Place standoffs in cases matching motherboard mounting holes. Ensure standoff positioning only where motherboard has corresponding holes preventing short circuits.
- CPU and Memory Pre-installation (Optional but recommended): Install CPU, memory, and CPU cooler on motherboard before board securing in case. This provides easier access reducing damage risks.
- Motherboard Alignment and Securing: Carefully place motherboard onto standoffs, aligning with I/O shield ensuring all standoffs align with holes. Secure motherboard with appropriate screws ensuring firm and stable positioning without overtightening.
- Final Assembly: Connect power supplies, disk drives, and additional adapter cards to motherboard. Attach all necessary data and power connectors.
- Cable Management: Plan and route cables neatly maintaining airflow and preventing case clutter.
2.2.9 Motherboard Headers and Power Connection Systems
Beyond slots and sockets for system devices, motherboards include connectors for components such as case buttons, speakers, and fans.
Header Connections
Front and rear case panel components connect to motherboard headers:
- Power button (soft power): Sends signals interpretable by OS as shutdown commands rather than PC power switching. Holding power buttons for seconds cuts power bypassing OS
- Drive (HDD) activity lights: Indicate internal hard disk access. Corresponding connectors usually labeled "HDD LED" or similar on motherboards
- Audio ports: Enable speaker and/or headphone and microphone connections. Front panel audio ports typically connect to motherboards via HD Audio headers, often labeled "HD Audio" (or "AC'97" for legacy systems)
- USB ports: Internal USB 2 connections utilize 9-pin headers. These headers support up to two 4-pin USB ports with 9th pins ensuring correct cable orientation. USB 3 headers use 20-pin (2x10) formats connecting to two USB 3.x ports supporting faster data transfer rates compared to USB 2.0
System disassembly requires diagrams or photographs documenting header connector positions and orientations. Without available diagrams, reference motherboard documentation or wire and header labels. These labels can be small or difficult to interpret making careful documentation important.
Power Connection Points
Motherboards contain various connection points for power supplies and fans:
- Main Power Connector: Primary P1 motherboard power connector features distinctive 24-pin blocks (2 rows of 12 pins) with square pin receptacles
- Fan Connectors:
- 3-pin Molex KK format connectors: Typically used for fans controlling fan speed through voltage variation
- 4-pin fan Molex KK format connectors: Support precise fan-speed control via pulse width modulation (PWM) with PWM signals carried by blue wires. One exists for CPU and one or more for case fans and components such as memory and video adapters
3-Pin fans on 4-pin headers usually function with 4-pin headers though systems may not vary fan speeds without special configuration. 4-Pin fans on 3-pin headers generally work with 3-pin headers but cannot utilize PWM for speed control.
2.2.10 Graphics Card Technology
Expansion cards enhance motherboards by adding functions or ports not originally supported, fitting into PCIe or PCI slots. Common types include sound, video, capture, and network cards.
Graphics cards (or graphics adapters) generate signals for monitors or projectors. Low-end graphics adapters, known as integrated or onboard graphics, are often built into motherboard chipsets or CPUs. Tasks like 3D gaming, CAD, or digital artwork usually require more powerful discrete graphics cards installed via PCIe motherboard slots. Most graphics adapters utilize chipsets from AMD, NVIDIA, and Intel. Typical graphics card features include:
Graphics Card Components:
- Graphics Processing Unit (GPU): Microprocessors optimized for rendering 2-D and 3-D images and effects on-screen. Key performance indicators include frame rates and support for advanced texture and lighting effects.
- Graphics Memory: 3-D graphics cards require substantial memory for processing and storing textures. High-end cards may feature up to 24 GB GDDR memory, while mid-range cards typically provide 8–12 GB. Low-end cards may utilize shared memory from system RAM.
- Video Ports: Contemporary graphics cards typically feature HDMI, DisplayPort, and sometimes USB-C with DisplayPort or Thunderbolt capabilities determining monitor or projector types and quantities for connection.
Graphics Double Data Rate (GDDR) memory optimizes for GPU high bandwidth requirements similar to DDR memory used in system RAM.
Most contemporary graphics cards utilize PCIe x16 slots providing necessary bandwidth for high-performance graphics. Some configurations use multiple graphics cards in multiple PCIe slots configured for cooperative operation.
2.2.11 Video Capture Card Systems
While graphics cards generate output video signals driving monitors, capture cards record video input saving as files or streaming live content. Commonly used for recording or streaming gameplay, capture cards can also capture video from other sources.
Capture Card Categories:
- Game Capture Cards: Designed for recording or streaming gameplay footage, capable of capturing video from PCs or game consoles via HDMI
- HDMI Capture Cards: Record video from various HDMI sources including game consoles, camcorders, and security cameras used for live streaming, video production, and content creation
- TV Tuner Cards: Receive and record video from broadcast TV sources enabling users to watch and record live TV on computers
Installation and Connectivity Options:
- Internal Capture Cards: Install inside computers using PCIe slots offering lower latency and higher performance suitable for professional use
- External Capture Cards: Connect to computers via USB or Thunderbolt providing portability and easy installation ideal for casual users or those requiring card usage with multiple devices
2.2.12 Audio Card Technology
Speakers or headphones connect to sound cards or motherboard integrated audio via 3.5 mm (⅛ inch) audio jacks, also known as phone plugs or mini TRS connectors. These jacks support standard audio output and input for headphones, speakers, or microphones.
Basic sound chips may be provided as motherboard chipset components, though better-quality audio functions can be provided as PCIe or PCI expansion cards. Professional-level cards may feature onboard memory, flash memory storing sound samples (wavetables), and additional jack types for different input sources.
Sound cards serve both audio playbook and recording input from microphones offering better sound quality and additional features compared to onboard audio.
Sound cards supporting multiple output channels can deliver audio ranging from mono or stereo to advanced surround sound creating immersive cinematic experiences with multiple speakers positioned around listeners.
2.2.13 Network Interface Card Technology
Most computers feature Ethernet network adapters integrated into motherboard chipsets. However, add-on network interface card installation may be necessary for upgrading to different network types or cabling such as copper versus fiber optic. Dedicated NICs can also provide multiple ports which can be bonded into single higher bandwidth links.
Wi-Fi adapters can be added for wireless network connections supporting various 802.11 standards. Some cards can also connect to cellular data networks.